Wafer Fab Equipment (WFE) vendors’ revenues collectively climbed 12% YoY in 2025, reaching $143 billion, says Counterpoint Research. The growth was propelled by the massive build-out of AI ...
Panel-level packaging is arriving not because the engineering is ready, but because wafer-level economics are breaking down.
NexWafe’s EpiNex solar wafers achieved 24.4% efficiency on a commercial M6 heterojunction (HJT) cell line, for the first time delivering performance parity with conventional CZ wafers. Modules made ...
Power consumption is a crucial consideration for all types of electronics. As critical power components used in a wide range of electronic products, power MOSFET and other types of power semiconductor ...
Share on Facebook (opens in a new window) Share on X (opens in a new window) Share on Reddit (opens in a new window) Share on Hacker News (opens in a new window) Share on Flipboard (opens in a new ...
In an update to its International Technology Roadmap for Photovoltaics, German engineering association the VDMA notes standardization of wafer size is a topic of great interest to the country’s PV ...
BEDFORD, Mass. & SEOUL, South Korea--(BUSINESS WIRE)--Silicon wafer manufacturer 1366 Technologies together with its strategic partners, Hanwha Q CELLS Malaysia Sdn. Bhd. and parent company Hanwha Q ...
FREMONT, Calif., March 18, 2020 (GLOBE NEWSWIRE) -- ACM Research, Inc. (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging ...
German wafer manufacturer NexWafe GmbH announced it achieved a power conversion efficiency of 24.4% for a heterojunction (HJT) solar cell built with its ultrathin wafers. The company said the ...
MIDLAND, Mich.–The Dow Chemical Co. today said International Sematech in Austin, Tex., will supply process wafers to the newly formed SiLKnet Alliance, which will use the substrates to develop ...
LONDON — Surface Technology Systems plc, a developer of plasma etch systems, has announced that it intends to build a Deep Reactive Ion Etch (DRIE) system suitable for 300-mm diameter wafers. The ...
Concept of mask/wafer co-optimization by moving the shot with mask and wafer double simulation to minimize wafer error. VSB shot configurations and its corresponding ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results